Light emitting diode package and manufacturing method thereof
US8933474B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Aug 1, 2012 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Oct 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
Abstract
A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.