Patent · US Active

Electronic assembly with improved thermal management

US8933546B2 · kind B2 · utility

0Cited by

3References

11Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Paeivi Lehtonen · Fellbach, DE
Thomas Kaden · Dresden, DE
Denis Gugel · Dußlingen, DE
Thomas Suenner · Neustadt, DE
Tim Behrens · Nørresundby, DK

Key dates

Filing date	Nov 11, 2011
Grant date	Jan 13, 2015
Priority date	—
Expiry date	Nov 11, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic assembly includes a leadframe (2), a semiconductor component (3), and an electrically conductive connecting element (4) made of a composite material (5). The connecting element (4) has a solderable metallization (6) on the composite material (5) on a surface that is directed towards the semiconductor component (3). A thermal conductivity of the composite material (5) of the connecting element (4) is greater than a thermal conductivity of the semiconductor component (3) and less than a thermal conductivity of the leadframe (2). The connecting element (4) is provided only locally in the region of the semiconductor component (3).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.