Electrically broken, but mechanically continuous die seal for integrated circuits
US8933567B2 · kind B2 · utility
6Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2010 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | May 31, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die has multiple discontinuous conductive segments arranged around a periphery of the semiconductor die, and an electrically insulating barrier within discontinuities between the conductive segments. The conductive segments and the barriers form a mechanically continuous seal ring around the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.