David Bang
17Patents
9h-index
18Co-inventors
65Inventor score
Filing activity: Sep 30, 1994 → May 21, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5949143A | Semiconductor interconnect structure with air gap for reducing intralayer capacitance in metal layers in damascene metalization process | Electricity | 68 | Expired |
| US6268277A | Method of producing air gap for reducing intralayer capacitance in metal layers in damascene metalization process and product resulting therefrom | Electricity | 33 | Expired |
| US5643428A | Multiple tier collimator system for enhanced step coverage and uniformity | Electricity | 32 | Expired |
| US6047243A | Method for quantifying ultra-thin dielectric reliability: time dependent dielectric wear-out | Physics | 22 | Expired |
| US6127193A | Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure | Electricity | 22 | Expired |
| US6169039A | Electron bean curing of low-k dielectrics in integrated circuits | Emerging Cross-Sectional Technologies | 20 | Expired |
| US5953625A | Air voids underneath metal lines to reduce parasitic capacitance | Electricity | 20 | Expired |
| US5580428A | PVD sputter system having nonplanar target configuration and methods for constructing same | Chemistry; Metallurgy | 15 | Expired |
| US5556525A | PVD sputter system having nonplanar target configuration and methods for operating same | Chemistry; Metallurgy | 12 | Expired |
| US9159910B2 | One-mask MTJ integration for STT MRAM | Electricity | 8 | Active |
| US8933567B2 | Electrically broken, but mechanically continuous die seal for integrated circuits | Electricity | 6 | Active |
| US8207569B2 | Intertwined finger capacitors | Emerging Cross-Sectional Technologies | 5 | Active |
| US8483997B2 | Predictive modeling of contact and via modules for advanced on-chip interconnect technology | Physics | 3 | Active |
| US6274915A | Method of improving MOS device performance by controlling degree of depletion in the gate electrode | Electricity | 3 | Expired |
| US7675372B2 | Circuit simulator parameter extraction using a configurable ring oscillator | Physics | 3 | Active |
| US6380556B1 | Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structure | Electricity | 2 | Expired |
| US7973541B2 | Method and apparatus for estimating resistance and capacitance of metal interconnects | Physics | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.