Integrated rf MEMS, control systems and methods
US8936959B1 · kind B1 · utility
9Cited by
92References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2011 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Jan 30, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0792
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An rf MEMS system has a semiconductor substrate, e.g., silicon. The system also has a control module provided overlying one or more first regions of the semiconductor substrate according to a specific embodiment. The system also has a base band module provided overlying one or more second regions of the semiconductor substrate and an rf module provided overlying one or more third regions of the semiconductor substrate. The system also has one or more MEMS devices integrally coupled to at least the rf module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.