Techniques for generating three dimensional structures
US8937019B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2013 |
| Grant date | Jan 20, 2015 |
| Priority date | — |
| Expiry date | Apr 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31144
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Techniques for forming a three dimensional (3D) feature on a substrate are disclosed. In one exemplary embodiment, the technique may be realized as a method comprising: forming a resist structure on the substrate, the resist structure having a first resist portion with a first thickness, a second resist portion with a second thickness, and a third resist portion with a third thickness, where the first thickness may be less than the second thickness, and where the second thickness may be less than the third thickness; implanting charged particles into the substrate through the first and second resist portions and forming an implanted region in the substrate; and etching the substrate to form the 3D feature on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.