Patrick M. Martin
22Patents
7h-index
38Co-inventors
69Inventor score
Filing activity: Sep 24, 1991 → Aug 3, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5220157A | Scrip controlled cash dispensing system | Physics | 20 | Expired |
| US5508233A | Global planarization process using patterned oxide | Electricity | 18 | Expired |
| US8133804B1 | Method and system for modifying patterned photoresist using multi-step ion implantation | Electricity | 16 | Active |
| US9716012B2 | Methods of selective layer deposition | Electricity | 12 | Active |
| US8460569B2 | Method and system for post-etch treatment of patterned substrate features | Electricity | 11 | Active |
| US7894918B2 | System for analyzing batch processes | Physics | 9 | Active |
| US5635428A | Global planarization using a polyimide block | Electricity | 7 | Expired |
| US8912097B2 | Method and system for patterning a substrate | Electricity | 5 | Active |
| US8354655B2 | Method and system for controlling critical dimension and roughness in resist features | Electricity | 5 | Active |
| US8435727B2 | Method and system for modifying photoresist using electromagnetic radiation and ion implantation | Physics | 3 | Active |
| US7049034B2 | Photomask having an internal substantially transparent etch stop layer | Physics | 3 | Expired |
| US9340877B2 | Method and system for modifying photoresist using electromagnetic radiation and ion implantation | Physics | 3 | Active |
| US9406507B2 | Utilization of angled trench for effective aspect ratio trapping of defects in strain relaxed heteroepitaxy of semiconductor films | Electricity | 2 | Active |
| US8778603B2 | Method and system for modifying substrate relief features using ion implantation | Electricity | 1 | Active |
| US8974683B2 | Method and system for modifying resist openings using multiple angled ions | Physics | 1 | Active |
| US9767987B2 | Method and system for modifying substrate relief features using ion implantation | Electricity | 0 | Active |
| US8698109B2 | Method and system for controlling critical dimension and roughness in resist features | Electricity | 0 | Active |
| US9425027B2 | Methods of affecting material properties and applications therefor | Electricity | 0 | Active |
| US9799531B2 | Utilization of angled trench for effective aspect ratio trapping of defects in strain-relaxed heteroepitaxy of semiconductor films | Electricity | 0 | Active |
| US8952344B2 | Techniques for processing photoresist features using ions | Physics | 0 | Active |
| US8937019B2 | Techniques for generating three dimensional structures | Electricity | 0 | Active |
| US10026613B2 | Utilization of angled trench for effective aspect ratio trapping of defects in strain-relaxed heteroepitaxy of semiconductor films | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.