Primary circuit board non-conductive void having different planar dimensions through board thickness to secure non-conducting locking member of holder
US8939791B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2013 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Mar 31, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A primary circuit board has a front surface, a back surface, and a non-conductive void. The void has first planar dimensions through a first portion of a thickness of the primary circuit board extending from the front surface to a position between the front and back surfaces, and second planar dimensions through a second portion of the thickness extending from the position at least towards the back surface. A secondary circuit board holder includes a non-conducting locking member insertable into the non-conductive void at the primary circuit board's front surface to secure the holder while a conductive part of the holder is conductively affixed to a conductive part of the primary circuit board. The first planar dimensions are different than the second planar dimensions to permit the primary circuit board's thickness to be greater than a maximum thickness specification of the holder's non-conducting locking member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.