Membrane assembly and carrier head having the membrane assembly
US8939817B2 · kind B2 · utility
6Cited by
9References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 29, 2012 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | May 29, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B41/061
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a membrane assembly of a carrier head in a chemical-mechanical polishing apparatus. The membrane assembly includes a main membrane and a circular ring. The main membrane has a wafer contacting surface in contact with a wafer while a chemical-mechanical polishing process is being performed. The circular ring is disposed at an edge portion of the main membrane and receives an air pressure to downwardly apply the air pressure to the main membrane at the edge portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.