Cleaning composition for temporary wafer bonding materials
US8940104B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2011 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Jun 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1116
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning composition for removing temporary wafer bonding material is provided. The cleaning composition comprises an alkylarylsulfonic acid and an aliphatic alcohol dispersed or dissolved in a hydrocarbon solvent system. Methods of separating bonded substrates and cleaning debonded substrates using the cleaning composition are also provided. The invention is particularly useful for temporary bonding materials and adhesives. The methods generally comprise contacting the bonding material with the cleaning solution for time periods sufficient to dissolve the desired amount of bonding material for separation and/or cleaning of the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.