Method and device for cutting semiconductor wafers
US8940618B2 · kind B2 · utility
1Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2012 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Mar 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for cutting a semiconductor wafer into semiconductor chips that reduces defects at the semiconductor chip corners. The method includes a pre-cutting processing step of trimming the semiconductor chip corners so that mechanical stress is reduced at the corners. The method includes dicing channels on a semiconductor wafer thereby defining the geometrical shape of one of the semiconductor chips, modifying the corners of the one of the semiconductor chips, and cutting the semiconductor wafer to separate the one of the semiconductor chips from other semiconductor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.