Method for manufacturing compound semiconductor device and detergent
US8940622B2 · kind B2 · utility
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1References
8Claims
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Assignee
Inventor
Key dates
| Filing date | Feb 10, 2012 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Jan 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8503
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method for manufacturing a compound semiconductor device, the method includes: forming a compound semiconductor laminated structure; removing a part of the compound semiconductor laminated structure, so as to form a concave portion; and cleaning the inside of the concave portion by using a detergent, wherein the detergent contains a base resin compatible with residues present in the concave portion and a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.