Dual sided workpiece handling
US8941082B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2013 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Sep 18, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/84
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A processing apparatus includes a process chamber defining an enclosed volume, and a dual sided workpiece assembly disposed in the enclosed volume. The dual sided workpiece assembly includes a base portion and a flip portion coupled to the base portion. The flip portion has a support surface configured to support at least one dual sided workpiece and is configured to rotate about a flipping axis. The processing apparatus also includes a controller configured to control the dual sided workpiece assembly to expose a first side of the at least one dual sided workpiece to accelerating ions in the process chamber during a first time interval and to expose a second side of the at least one dual sided workpiece to accelerating ions during a second time interval different than the first time interval by rotating the flip portion about the flipping axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.