MEMS device package with conductive shell
US8941223B2 · kind B2 · utility
1Cited by
3References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Mar 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS lead frame package body encloses a MEMS device enclosed in an internal cavity formed by the mold body and cover. A conductive internal shell with a connection window sits in the cavity. The MEMS device is mounted in the shell and electrically coupled to the lead frame through wire bonds directed through the connection window. To accommodate a MEMS microphone, an acoustic aperture extends through the mold body aligned with a hole in the internal shell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.