Multilayer ceramic electronic component and method of manufacturing the same
US8941973B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2012 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Feb 8, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/43
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There are provided a multilayer ceramic electronic component and a manufacturing method thereof, the multilayer ceramic electronic component including: a ceramic body including dielectric layers; a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein a thickness to of the internal electrode satisfies 0.1 μm≦Te≦0.5 μm, and when, in a cross-section of the ceramic body taken in length and thickness directions, cut through a central portion of the ceramic body in a width direction, a distance, in the length direction, of a central portion of an internal electrode grain closest to a disconnected portion of the internal electrode is denoted by Tc, and a distance, in the length direction, of the internal electrode grain at a point equal to 25% of the thickness thereof above or below the central portion thereof is denoted by Tl, 0.7≦Tl/Tc≦1.3 is satisfied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.