Auto device skew manufacturing
US8942840B2 · kind B2 · utility
2Cited by
19References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2013 |
| Grant date | Jan 27, 2015 |
| Priority date | — |
| Expiry date | Jan 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A system and method for manufacturing semiconductor devices is disclosed. An embodiment comprises using desired device parameters to choose an initial manufacturing recipe. Once chosen, the initial manufacturing recipe may be modified by determining and applying an offset adjustment based on previous manufacturing to tune the recipes for the particular equipment to be utilized in the manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.