Plasma processing apparatus and plasma processing method
US8945411B2 · kind B2 · utility
3Cited by
4References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 26, 2012 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Apr 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68771
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is to achieve a reduction both in size of a plasma processing apparatus and an installation area thereof. A dry etching apparatus includes a stock unit that includes a cassette storing a tray that can be conveyed and that stores substrates. In a conveying unit storing a conveying apparatus of the tray, a rotary stage is provided. Rotational angular position adjustment of the tray is performed by rotating the rotary stage placed on the tray before being subjected to dry etching and detecting a notch by a notch detecting sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.