Patent · US Active

Chip package and method of forming the same

US8945990B2 · kind B2 · utility

1Cited by

1References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Holger Torwesten · Neubiberg, DE
Manfred Mengel · Bad Abbach, DE
Stefan Schmid · Waiblingen, DE
Soon Lock Goh · Melaka City, MY
Swee Kah Lee · Melaka City, MY

Key dates

Filing date	Apr 24, 2012
Grant date	Feb 3, 2015
Priority date	—
Expiry date	May 21, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.