Backplane reinforcement and interconnects for solar cells

US8946547B2 · kind B2 · utility

Assignee

• Solexel, Inc. · US

Inventors

• Mehrdad M. Moslehi · Dallas, US
• David Xuan-Qi Wang · Fremont, US
• Karl-Josef Kramer · San Jose, US
• Sean M. Seutter · Fremont, US
• Sam Tone Tor · Pleasanton, US
• Anthony Calcaterra · Milpitas, US

Key dates

• Filing date: Aug 5, 2011
• Grant date: Feb 3, 2015
• Expiry date: Dec 10, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/547

Abstract

Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.