Package assembly and method of tuning a natural resonant frequency of a package
US8947887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2009 |
| Grant date | Feb 3, 2015 |
| Priority date | — |
| Expiry date | Dec 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package assembly comprises an electronic device; a package body; at least a first plurality of leads having a first geometrical shape and a second plurality of leads having a second geometrical shape, protruding from the package body; each of the first plurality of leads being located in corners of the package body; or the first and the second plurality of leads arranged in at least a first row and a second row located in parallel to the first row; each of the rows comprising at least two leads; the first row being transformable into the second row by mirroring the first row along a symmetry plane of the package body; each of the first plurality of leads having the first geometrical shape different from the second geometrical shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.