Method of fabricating a flip chip semiconductor die with internal signal access
US8951814B2 · kind B2 · utility
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89References
17Claims
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Key dates
| Filing date | Jan 22, 2013 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Jan 22, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method for providing access to a signal of a flip chip semiconductor die. A hole is bored into a semiconductor die to a test probe point. The hole is backfilled with a conductive material, electrically coupling the test probe point to a signal redistribution layer. A conductive bump of the signal redistribution layer is electrically coupled to a conductive contact of a package substrate. An external access point of the package substrate is electrically coupled to the conductive contact, such that signals of the flip chip semiconductor die are accessible for measurement at the external access point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.