Howard Lee Marks
10Patents
3h-index
6Co-inventors
49Inventor score
Filing activity: Jul 31, 2003 → Jul 16, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8357931B2 | Flip chip semiconductor die internal signal access system and method | Emerging Cross-Sectional Technologies | 70 | Active |
| US7842948B2 | Flip chip semiconductor die internal signal access system and method | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7453158B2 | Pad over active circuit system and method with meshed support structure | Electricity | 5 | Expired |
| US7429528B2 | Method of fabricating a pad over active circuit I.C. with meshed support structure | Electricity | 2 | Expired |
| US7495343B1 | Pad over active circuit system and method with frame support structure | Electricity | 2 | Expired |
| US7791193B2 | Pad over active circuit system and method with meshed support structure | Electricity | 2 | Active |
| US7649269B2 | Pad over active circuit system and method with frame support structure | Electricity | 1 | Active |
| US8017520B2 | Method of fabricating a pad over active circuit I.C. with frame support structure | Electricity | 0 | Active |
| US8951814B2 | Method of fabricating a flip chip semiconductor die with internal signal access | Emerging Cross-Sectional Technologies | 0 | Active |
| US11545450B2 | Interlocked redistribution layer interface for flip-chip integrated circuits | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.