Patent · US Active

FCOC (Flip Chip On Chip) package and manufacturing method thereof

US8951840B2 · kind B2 · utility

1Cited by

8References

4Claims

0Family size

Assignee

BEIJING UNIVERSITY OF TECHNOLOGY · CN

Inventors

Fei Qin · Lo Wu, CN
Guofeng Xia · Shanghai, CN
Tong An · Beijing, CN
Chengyan Liu · Beijing, CN
Wei Wu · Beijing, CN
Wenhui Zhu · Beijing, CN

Key dates

Filing date	Dec 4, 2012
Grant date	Feb 10, 2015
Priority date	—
Expiry date	Dec 4, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A manufacturing method for Flip Chip on Chip (FCoC) package based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating first IC chip, second IC chip, solder bumps, underfill material, and metal wire to form an array of FCoC package based on the type of multi-row QFN package. Sawing and separating the FCoC package array, and forming FCoC package unit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.