Chengyan Liu
2Patents
1h-index
5Co-inventors
27Inventor score
Filing activity: Dec 4, 2012 → Dec 4, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8951840B2 | FCOC (Flip Chip On Chip) package and manufacturing method thereof | Electricity | 1 | Active |
| US9397068B2 | Package in package (PiP) electronic device and manufacturing method thereof | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.