Implementing graphene interconnect for high conductivity applications
US8952258B2 · kind B2 · utility
19Cited by
16References
19Claims
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Key dates
| Filing date | Sep 21, 2012 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Aug 3, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method, and structures for implementing enhanced interconnects for high conductivity applications. An interconnect structure includes an electrically conductive interconnect member having a predefined shape with spaced apart end portions extending between a first plane and a second plane. A winded graphene ribbon is carried around the electrically conductive interconnect member, providing increased electrical current carrying capability and increased thermal conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.