Patent · US Active

Semiconductor package and method for fabricating the same

US8952489B2 · kind B2 · utility

45Cited by

2References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Klaus Elian · Alteglofsheim, DE
Jens Pohl · San Luis Obispo, US
Horst Theuss · Wenzenbach, DE
Renate Hofmann · Regensburg, DE
Alexander Glas · Munich, DE
Carsten Ahrens · Birkenfeld, DE

Key dates

Filing date	Oct 9, 2012
Grant date	Feb 10, 2015
Priority date	—
Expiry date	Mar 18, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19104
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.