Patent · US Active

Integrated circuit package having bottom-side stiffener

US8952511B2 · kind B2 · utility

4Cited by

17References

9Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Ajit Sathe · Chandler, US
Mat J. Manusharow · Phoenix, US
Tong Wa Chao · Chandler, US

Key dates

Filing date	Dec 18, 2007
Grant date	Feb 10, 2015
Priority date	—
Expiry date	Oct 14, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments, the stiffening element is attached to the underlying circuit board. Other embodiments are described and claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.