Semiconductor device and method for manufacturing the same
US8952538B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2010 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Jul 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2064
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: an integrated circuit having an electrode pad; a first insulating layer disposed on the integrated circuit; a redistribution layer including a plurality of wirings and disposed on the first insulating layer, at least one of the plurality of wirings being electrically coupled to the electrode pad; a second insulating layer having a opening on at least a portion of the plurality of wirings; a metal film disposed on the opening and on the second insulating layer, and electrically coupled to at least one of the plurality of wirings; and a solder bump the solder bump overhanging at least one of the plurality of wirings not electrically coupled to the metal film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.