Exposure apparatus, exposure method, and method of manufacturing semiconductor device
US8953163B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2013 |
| Grant date | Feb 10, 2015 |
| Priority date | — |
| Expiry date | Apr 11, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/70
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An exposure apparatus according to an embodiment controls the positioning between layers using an alignment correction value calculated on the basis of lower layer position information of a lower-layer-side pattern and upper layer position information of an upper-layer-side pattern. The lower layer position information includes alignment data, a focus map, and a correction value which is set on the basis of the previous substrate. The upper layer position information includes alignment data, a focus map, and a correction value which is a correction value for the positioning and is used when the upper-layer-side pattern is transferred.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.