Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board
US8956732B2 · kind B2 · utility
3Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2007 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Jun 2, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.