Positive photosensitive resin composition, and organic insulator film for display device and display device fabricated using the same
US8956790B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2013 |
| Grant date | Feb 17, 2015 |
| Priority date | — |
| Expiry date | Jul 2, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0233
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a positive photosensitive resin composition that includes (A) at least one dissolution controlling agent selected from a compound including a repeating unit represented by the following Chemical Formula 1, a compound including a repeating unit represented by the following Chemical Formula 2, or a combination thereof, (B) a polybenzoxazole precursor, (C) a photosensitive diazoquinone compound, and (D) a solvent. An organic insulator film for a display device manufactured using the same and a display device are also disclosed.In Chemical Formulae 1 and 2, each substituent is the same as defined in the detailed description.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.