Method of manufacturing a printed circuit board having an embedded electronic component
US8959756B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2008 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Nov 19, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a core substrate having an electronic component, including providing a core substrate having a first surface and a second surface on an opposite side of the first surface, forming a through hole extending from the first surface to the second surface in the core substrate, attaching an adhesive tape to the second surface of the core substrate such that the through hole formed in the core substrate is closed on the second surface, attaching an electronic component to the adhesive tape inside the through hole, filling the through hole with a filler, and removing the adhesive tape from the second surface of the core substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.