Method and device for aligning substrates

US8961094B2 · kind B2 · utility

Assignee

• SINGULUS TECHNOLOGIES AG · DE

Inventors

• Edgar Rüth · Kahl am Main, DE
• Wolfgang Becker · Eppstein, DE
• Marjan Filipovic · Nidda, DE
• Reiner Rohrmann · Alzenau, DE

Key dates

• Filing date: Apr 6, 2010
• Grant date: Feb 24, 2015
• Expiry date: Apr 6, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S901/47
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

The invention relates to a method and a device for aligning substrates (2) in an XY-plane. A polygonal, flat substrate (2), the substrate plane of which is parallel to the XY-plane or lies in the XY-plane, is aligned with respect to reference coordinates and a reference angular position in the XY-plane. A corner (12) of the substrate (2) is detected using image detecting means (9). In addition, the position coordinates of the substrate (2) are determined. Using evaluating means (10), the angular position of the corner (12) of the substrate (2) in the XY-plane is determined, and the position differences between the reference coordinates and the position coordinates as well as the angle difference between the reference angular position and the angular position of the substrate corner (12) are calculated. The substrate (2) is moved and/or rotated in the XY-plane according to the determined position difference or the angle difference. By rotating the substrate (2) several times, each corner (12) and edge (13, 14) of the substrate (2) can be detected using the image detecting means (9). This enables an edge inspection during the substrate transport so that additional process steps such …