Patent · US Active

Chip socket including a circular contact pattern

US8961193B2 · kind B2 · utility

2Cited by

12References

10Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Gaurav Chawla · Tempe, US
Vijaykumar Krithivasan · Chandler, US
Joshua D. Heppner · Chandler, US

Key dates

Filing date	Dec 12, 2012
Grant date	Feb 24, 2015
Priority date	—
Expiry date	Dec 12, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4922
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

An apparatus for coupling an integrated circuit to other electronics can include a housing having an exterior and an interior, the exterior having an exterior bottom surface, the interior defined by an interior bottom surface opposite the exterior bottom surface, and at least one sidewall extending away from the interior bottom surface to define an interior shape that is sized to receive the integrated circuit, with the integrated circuit disposed against the interior bottom surface and the at least one sidewall. The example can include a plurality of exterior contacts exposed along the exterior bottom surface in an exterior contact pattern that is generally circular in shape.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.