Method and apparatus for supporting a computer chip on a printed circuit board assembly
US8962388B2 · kind B2 · utility
1Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2011 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Nov 9, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.