Method of manufacturing semiconductor device by mounting and positioning a semiconductor die using detection marks
US8962405B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2013 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Mar 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In some aspects of the invention, a circuit pattern of a front surface structure is formed in a front surface of a semiconductor wafer and an alignment mark is formed on the front surface of a semiconductor wafer. A transparent supporting substrate is attached to the front surface of the semiconductor wafer by a transparent adhesive. Then, a resist is applied onto a rear surface of the semiconductor wafer. Then, the semiconductor wafer is mounted on a stage of an exposure apparatus, with the supporting substrate down. Then, the alignment mark formed on the front surface of the semiconductor wafer is recognized by a camera, and the positions of the semiconductor wafer and a photomask are aligned with each other. Then, the resist is patterned. Then, a circuit pattern is formed in the rear surface of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.