Tsunehiro Nakajima
23Patents
2h-index
24Co-inventors
53Inventor score
Filing activity: Jun 16, 2006 → Oct 30, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9147599B2 | Wafer support system and method for separating support substrate from solid-phase bonded wafer and method for manufacturing semiconductor device | Electricity | 4 | Active |
| US9685333B2 | Manufacturing method of silicon carbide semiconductor device | Electricity | 3 | Active |
| US8324044B2 | Method of producing a semiconductor device with an aluminum or aluminum alloy electrode | Electricity | 1 | Active |
| US9564334B2 | Method of manufacturing a semiconductor device | Electricity | 1 | Active |
| US8604584B2 | Semiconductor device and method of manufacturing semiconductor device | Electricity | 1 | Active |
| US9972521B2 | Method for manufacturing semiconductor device to facilitate peeling of a supporting substrate bonded to a semiconductor wafer | Electricity | 1 | Active |
| US9922858B2 | Semiconductor device manufacturing method | Emerging Cross-Sectional Technologies | 1 | Active |
| US7897452B2 | Method of producing a semiconductor device with an aluminum or aluminum alloy rear electrode | Electricity | 1 | Active |
| US9741587B2 | Semiconductor device and semiconductor device manufacturing method | Electricity | 1 | Active |
| US9548205B2 | Method of manufacturing a semiconductor device | Electricity | 1 | Active |
| US8999768B2 | Semiconductor device manufacturing method | Electricity | 1 | Active |
| US10600921B2 | Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device | Electricity | 1 | Active |
| US8962405B2 | Method of manufacturing semiconductor device by mounting and positioning a semiconductor die using detection marks | Electricity | 1 | Active |
| US9070736B2 | Semiconductor device | Electricity | 0 | Active |
| US9905684B2 | Semiconductor device having schottky junction between substrate and drain electrode | Electricity | 0 | Active |
| US9892919B2 | Semiconductor device manufacturing method | Electricity | 0 | Active |
| US9972499B2 | Method for forming metal-semiconductor alloy using hydrogen plasma | Electricity | 0 | Active |
| US9728441B2 | Method for manufacturing semiconductor device | Electricity | 0 | Active |
| US11658231B2 | Semiconductor device | Electricity | 0 | Active |
| US10079155B2 | Semiconductor device manufacturing method | Electricity | 0 | Active |
| US9355858B2 | Method of manufacturing semiconductor device | Electricity | 0 | Active |
| US10374050B2 | Silicon carbide semiconductor device and manufacturing method of silicon carbide semiconductor device | Electricity | 0 | Active |
| US8722487B2 | Semiconductor device with an electrode including an aluminum-silicon film | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.