Integrated circuits and systems and methods for producing the same
US8963135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2012 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Apr 20, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y50/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Three dimensional integrated circuits including semiconductive organic materials are described. In some embodiments, the three dimensional integrated circuits include one or more electronic components that include a semiconductive region formed of one or more semiconductive organic materials. The electronic components of the three dimensional integrated circuits may also include insulating regions formed from organic insulating materials, and conductive regions form from conductive materials. The three dimensional integrated circuits may be formed by an additive manufacturing process such as three dimensional printing. Apparatus and methods for producing and testing three dimensional integrated circuits are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.