Pixel via and methods of forming the same
US8963159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2011 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Nov 29, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/001
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
This disclosure provides systems, methods and apparatuses for pixel vias. In one aspect, a method of forming an electromechanical device having a plurality of pixels includes depositing an electrically conductive black mask on a substrate at each of four corners of each pixel, depositing a dielectric layer over the black mask, depositing an optical stack including a stationary electrode over the dielectric layer, depositing a mechanical layer over the optical stack, and anchoring the mechanical layer over the optical stack at each corner of each pixel. The method further includes providing a conductive via in a first pixel of the plurality of pixels, the via in the dielectric layer electrically connecting the stationary electrode to the black mask, the via disposed at a corner of the first pixel, offset from where the mechanical layer is anchored over the optical stack in an optically non-active area of the first pixel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.