Semiconductor package and fabrication method thereof
US8963299B2 · kind B2 · utility
4Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2012 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Nov 22, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.