PoP structure with electrically insulating material between packages
US8963311B2 · kind B2 · utility
7Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2012 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Feb 28, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.