Semiconductor chip with through hole vias
US8963319B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2012 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Apr 20, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor chip includes a semiconductor substrate, a via and an insulating layer. The semiconductor substrate has a first major surface and a second major surface on opposite side from the first major surface. The semiconductor substrate is provided with a circuit section including an element and a wiring and a guard ring structure section surrounding the circuit section on the first major surface side. The via is provided in a via hole extending from the first major surface side to the second major surface side of the semiconductor substrate. The insulating layer is provided in a first trench extending from the first major surface side to the second major surface side of the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.