System and method for defect analysis of a substrate
US8965102B2 · kind B2 · utility
3Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2012 |
| Grant date | Feb 24, 2015 |
| Priority date | — |
| Expiry date | Mar 11, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides a method including providing a first image and a second image. The first image is of a substrate having a defect and the second image is of a reference substrate. A difference between the first image and the second image is determined. A simulation model is used to generate a simulation curve corresponding to the difference and the substrate dispositioned based on the simulation curve. In another embodiment, the scan of a substrate is used to generate a statistical process control chart.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.