Patent · US Active

Method for cooling a workpiece made of semiconductor material during wire sawing

US8968054B2 · kind B2 · utility

0Cited by

9References

8Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Peter Wiesner · Simbach, DE
Anton Huber · Burghausen, DE

Key dates

Filing date	Dec 30, 2011
Grant date	Mar 3, 2015
Priority date	—
Expiry date	Jun 5, 2033

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D1/08
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for cooling a cylindrical workpiece during wire sawing includes applying a liquid coolant to a surface of the workpiece. The workpiece is made of semiconductor material having a surface including two end faces and a lateral face. The method includes sawing the workpiece with a wire saw including a wire web having wire sections arranged in parallel by penetrating the wire sections into the workpiece by an oppositely directed relative movement of the wire sections and the workpiece. Wipers are disposed so as to bear on the surface of the workpiece. The temperature of the workpiece is controlled during the wire sawing using a liquid coolant applied onto the workpiece above the wipers so as to remove the liquid coolant with the wipers bearing on the workpiece surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.