Uniform emission LED package

US8969908B2 · kind B2 · utility

Assignee

• Cree, Inc. · US

Inventors

• Gerald H. Negley · Durham, US
• Michael Leung · Goleta, US
• Maryanne Becerra · Lompoc, US
• Eric Tarsa · Goleta, US
• Peter Scott Andrews · Durham, US

Key dates

• Filing date: Apr 4, 2006
• Grant date: Mar 3, 2015
• Expiry date: Apr 4, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0362

Abstract

An emitter package comprising a light emitting diode (LED) mounted to the surface of a submount with the surface having a first meniscus forming feature around the LED. A matrix encapsulant is included on the surface and covering the LED. The outer edge of the matrix encapsulant adjacent the surface is defined by the meniscus forming feature and the encapsulant forms a substantially dome-shaped covering over said LED. A method for manufacturing an LED package by providing a body with a surface having a first meniscus holding feature. An LED is mounted to the surface with the meniscus holding feature around the LED. A liquid matrix encapsulant is introduced over the LED and the surface, the first meniscus holding feature holding the liquid matrix encapsulant in a dome-shape over the LED. The matrix encapsulant is then cured.