Multiple chip package module having inverted package stacked over die
US8970049B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2004 |
| Grant date | Mar 3, 2015 |
| Priority date | — |
| Expiry date | Feb 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A module having multiple die includes a first die on a first substrate and an inverted second package stacked over the first die, with, where necessary, provision is made for a standoff between the second package and the first die. Also, methods for making the module include steps of providing a first package having a first die attached onto an upward facing side of a first package substrate, and stacking an inverted second package over the die on the first package, provision being made where necessary for a standoff between the second package and the first package die to avoid damaging impact between the downward-facing side of the second package and wire bonds connecting the first die to the first package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.