Multilayer ceramic capacitor with terminal formed by electroless plating
US8974654B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 16, 2012 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Mar 16, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic capacitor and method of creating are provided. The capacitor includes a plurality of interior plates having edges that are brought to and exposed upon a first surface and also upon a portion of a second surface of the capacitor at a region where the second surface meets the first surface. An electroplated terminal is directly in contact with and mechanically and electrically connected to an edge of each of the interior plates where each plate's edge is exposed upon the first surface. The terminal wraps over the region of the capacitor from the first surface onto the portion of the second surface and is directly in contact with and mechanically and electrically connected to an edge of each of the interior plates where each plate's edge is exposed upon the second surface. The terminal does not extend to any additional surfaces which meet the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.