Hung Van Trinh
24Patents
10h-index
3Co-inventors
68Inventor score
Filing activity: May 28, 1998 → Aug 8, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7345868B2 | Multilayer ceramic capacitor with terminal formed by electroless plating | Electricity | 89 | Expired |
| US6081416A | Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic | Electricity | 42 | Expired |
| US6542352B1 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Electricity | 40 | Expired |
| US6545854B2 | Fringe-field non-overlapping-electrodes discoidal feed-through ceramic filter capacitor with high breakdown voltage | Electricity | 32 | Expired |
| US6753218B2 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Electricity | 28 | Expired |
| US6661639B1 | Single layer capacitor | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6822847B2 | Single layer capacitor | Emerging Cross-Sectional Technologies | 22 | Expired |
| US6751082B2 | CERAMIC CHIP CAPACITOR OF CONVENTIONAL VOLUME AND EXTERNAL FORM HAVING INCREASED CAPACITANCE FROM USE OF CLOSELY SPACED INTERIOR CONDUCTIVE PLANES RELIABLY CONNECTING TO POSITIONALLY TOLERANT EXTERIOR PADS THROUGH MULTIPLE REDUNDANT VIAS | Electricity | 15 | Expired |
| US6619763B2 | Feed-through filter capacitor with non-overlapping electrodes | Electricity | 14 | Expired |
| US7685703B1 | Method of making an essentially monolithic capacitor | Emerging Cross-Sectional Technologies | 10 | Active |
| US6969647B2 | Method of making single layer capacitor | Emerging Cross-Sectional Technologies | 8 | Expired |
| US8163331B2 | Multilayer ceramic capacitor with terminal formed by electroless plating | Electricity | 7 | Active |
| US6885539B1 | Single layer capacitor | Emerging Cross-Sectional Technologies | 5 | Expired |
| US9412519B1 | Multilayer ceramic capacitor with terminals formed by plating | Electricity | 4 | Active |
| US9786437B1 | High voltage fringe-effect capacitor | Electricity | 4 | Active |
| US8974654B1 | Multilayer ceramic capacitor with terminal formed by electroless plating | Electricity | 3 | Active |
| US11443898B2 | Multilayer broadband ceramic capacitor with internal air gap capacitance | Electricity | 2 | Active |
| US10262803B1 | High voltage fringe-effect capacitor | Electricity | 1 | Active |
| US9936589B2 | Electrical devices and methods for manufacturing same | Emerging Cross-Sectional Technologies | 1 | Active |
| US7444726B1 | Method of making an essentially monolithic capacitor | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9949378B2 | Electrical devices with solder dam | Emerging Cross-Sectional Technologies | 1 | Active |
| US10741330B1 | High voltage fringe-effect capacitor | Electricity | 1 | Active |
| US12136522B2 | Multilayer broadband ceramic capacitor with internal air gap capacitance | Electricity | 0 | Active |
| US11352709B1 | Helically ribbed electroplating barrel | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.