Method of manufacturing liquid discharge head
US8975097B2 · kind B2 · utility
0Cited by
0References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2014 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | May 27, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1639
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a liquid discharge head includes: forming a first hole which penetrates through a wafer and becomes at least part of a liquid supply port and a second hole which does not penetrate through the wafer and becomes at least part of a cut-off portion from a front side of the wafer; arranging a dry film on the front side of the wafer; forming a flow passage forming member by heating and developing the dry film; and cutting off the liquid discharge head from the wafer by grinding the wafer from a back side so that the second hole penetrates through the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.