Transmission line for electronic circuits
US8975737B2 · kind B2 · utility
0Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2011 |
| Grant date | Mar 10, 2015 |
| Priority date | — |
| Expiry date | Jun 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A transmission line formed in a device including a stack of first and second chips having their front surfaces facing each other and wherein a layer of a filling material separates the front surface of the first chip from the front surface of the second chip, this line including: a conductive strip formed on the front surface side of the first chip in at least one metallization level of the first chip; and a ground plane made of a conductive material formed in at least one metallization level of the second chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.